Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
2003185 pages
Springer US·1 editions
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (2003)
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (2003)
Springer US
Springer US
[electronic resource] /
ISBN 10: 1461349893
ISBN 13: 9781461349891